As semiconductor chip performance continues to advance, the importance of packaging and testing processes has become increasingly prominent. The industry faces critical challenges in ensuring chip reliability under extreme conditions while accelerating time-to-market for competitive advantage. Shenzhen Mifitek Technology Co., Ltd. has emerged as a key player addressing these challenges through its professional integrated circuit packaging and testing solutions.
Corporate Profile: A National High-Tech Enterprise with Strong Capabilities
Established in March 2018 with registered capital of 191 million RMB, Shenzhen Mifitek Technology Co., Ltd. has quickly gained recognition as a Sino-foreign joint venture and national high-tech enterprise. The company specializes in integrated circuit packaging and testing, earning designation as the Guangdong Provincial Engineering Technology Research Center for Advanced IC Packaging and Testing, demonstrating its leadership in the field.
Core Business: Comprehensive Packaging and Testing Services
Mifitek offers complete packaging and testing solutions ranging from 8-inch to 12-inch wafer testing (CP), finished product testing (FT), and various IC packaging technologies. The company provides diverse packaging options including SOP, ESOP, SSOP, QFN, LQFP, as well as specialized solutions for Hall device packaging, advanced stacked packaging, and ultra-thin high-reliability flexible multi-chip packaging. This full-range service capability simplifies supply chain management and significantly reduces product development cycles.
Technical Expertise: Experienced Team Driving Innovation
With a workforce of 780 employees including 89 R&D personnel (71.9% holding bachelor's degrees or intermediate professional titles), Mifitek boasts substantial technical capabilities. The management team brings over 30 years of semiconductor industry experience, combining talent from leading international and domestic packaging and testing companies. The technical team has participated in numerous national, provincial, and municipal-level engineering projects, completing key Shenzhen technological innovation initiatives such as "MCM Packaging and Testing Key Technology R&D," "WaferMap Intelligent Visual 12-inch High-Speed Automatic Recognition Classification System," and "Sensor Chip System-in-Package (SiP) Testing Key Technology R&D."
Facilities: Advanced Manufacturing and R&D Base
Mifitek operates a 16,000-square-meter production and R&D facility in Longgang District, Shenzhen, with total building area of 36,000 square meters. By the end of 2021, the company had invested over 700 million RMB in the project. State-of-the-art equipment and rigorous quality control systems ensure efficient production and reliable delivery.
Corporate Vision: Becoming a Globally Recognized IC Packaging and Testing Leader
Mifitek remains committed to its core values and mission, continuously enhancing its technical capabilities and service quality. The company aims to establish itself as a globally recognized IC packaging and testing enterprise through technological innovation and efficient customer service. Mifitek focuses on building long-term partnerships to jointly advance the development of the integrated circuit industry.