What powers the rapid development of emerging industries like new energy vehicles, smart grids, and consumer electronics? The answer lies in the continuous innovation of power semiconductor technology. As the "heart" of the electronics information industry, power semiconductors are experiencing unprecedented growth opportunities.
APSME 2025 - Asia International Power Semiconductor, Materials & Equipment Technology Exhibition will open the door to the future of the power semiconductor industry. Scheduled for November 21-24, 2025 at the China Import and Export Fair Complex (Area D) in Guangzhou, this event promises to be a landmark gathering for industry professionals.
Exhibition Highlights
Jointly organized by Shenzhen New Power Exhibition Co., Ltd. and Guangzhou JSW Exhibition Co., Ltd. in collaboration with authoritative semiconductor industry organizations, APSME 2025 will bring together leading global power semiconductor brands. The exhibition will showcase products and technologies across the entire industry chain, including:
- Semiconductor devices and power modules
- Advanced materials and packaging technologies
- Testing equipment and production machinery
- Thermal management solutions
The event aims to foster deep collaboration across the industry, connecting material suppliers with end-use manufacturers while promoting technological advancement in semiconductor devices, packaging, testing, and manufacturing processes.
Expected Participation
The exhibition anticipates hosting 300 exhibitors across 20,000 square meters of exhibition space, with over 10,000 professional visitors from leading companies in the power semiconductor sector. Attendees will include representatives from major automotive manufacturers, electronics companies, and semiconductor specialists.
Comprehensive Product Coverage
APSME 2025 will comprehensively cover all aspects of the power semiconductor industry chain:
Power Devices
Showcasing IGBTs, MOSFETs, diodes, transistors, and thyristors that form the backbone of modern power electronics.
Third-Generation Semiconductor Materials
Highlighting wide-bandgap materials like silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), diamond, gallium arsenide, and aluminum nitride (AlN) that represent the future of semiconductor technology.
Manufacturing Equipment
Featuring thinning machines, crystal growth furnaces, grinding equipment, heat treatment systems, lithography machines, etching equipment, ion implanters, and various CVD/PVD systems essential for semiconductor production.
Design and Development
Presenting EDA tools, IP design solutions, embedded software, and circuit design technologies that drive innovation in power semiconductors.
Packaging and Testing
Demonstrating advanced packaging techniques including screen printing, automatic die bonding, vacuum reflow soldering, ultrasonic cleaning, X-ray inspection, and laser marking.
Thermal Management
Focusing on heat dissipation solutions including thermal interface materials, carbon nanomaterials, high-thermal-conductivity packaging materials, and phase-change materials critical for power device performance.
Technical Forums
The exhibition will feature a series of high-level technical forums examining global industry trends and future technological directions:
- Automotive-Grade Power Semiconductor Forum
- IGBT/SiC Industry Development Forum
- Compound Semiconductor Technology and Applications Forum
- GaN Power Device Technology Symposium
- Si/SiC Power MOSFET Technology Conference
- SiC Substrate Material Growth and Processing Innovation Forum
- Third-Generation Semiconductor Manufacturing and Equipment Summit
- Power Semiconductor Device Performance and Testing Technology Forum
These forums will feature carefully selected speakers and topics, focusing on technical exchange while maintaining appropriate brand representation, ensuring attendees gain insights into the most advanced power semiconductor technologies.