The heart of China's western region will become the epicenter of technological innovation in 2026 as Xi'an prepares to host the China Western Semiconductor and Integrated Circuit Industry Expo. This landmark event will bring together global leaders in semiconductor technology, showcasing cutting-edge developments and fostering industry collaboration.
The expo will serve as a comprehensive platform combining equipment exhibitions with academic forums, attracting top executives, researchers, and technical experts from domestic and international semiconductor enterprises and institutions.
Industry Leaders Gather for Innovation Summit
Major Chinese semiconductor companies and research institutions will converge in Xi'an for the event, including:
- Northern Huachuang
- Empyrean Technology
- Unisoc
- Huaxin Semiconductor
- China Aerospace Information Innovation Institute
- Multiple research institutes under China Aerospace Science and Technology Corporation
- Key laboratories from China Electronics Technology Group Corporation
Multifaceted Event Structure
The expo will feature a diverse program format including:
- Main exhibition showcasing technological advancements
- Keynote forums on industry trends
- Technical workshops
- Awards ceremony for innovation competitions
Specialized sessions will address critical topics such as AI integration, microcontroller units (MCUs), supply chain dynamics, and emerging market demands, providing comprehensive insights across technological, commercial, and policy dimensions.
Regional Development Focus
Under the theme "Integration, Cooperation, and Mutual Benefit," the event aims to strengthen industry networks while promoting coordinated development of semiconductor clusters across western China. This initiative is expected to significantly influence the national semiconductor industry landscape.
Comprehensive Exhibition Coverage
The expo will showcase the complete semiconductor value chain through dedicated zones:
IC Design Zone: Featuring EDA tools, IP design solutions, and embedded software development platforms.
Manufacturing Technology Zone: Displaying advanced wafer fabrication processes from foundries and IDMs.
Packaging & Testing Zone: Presenting cutting-edge equipment including probe stations, test handlers, and bonding machines.
Materials Innovation Zone: Highlighting semiconductor-grade silicon, photomasks, specialty gases, and packaging substrates.
Equipment Showcase: Featuring critical tools from lithography systems to deposition equipment and metrology solutions.
Next-Gen Semiconductor Pavilion: Dedicated to wide-bandgap materials like GaN and SiC for power electronics and RF applications.
The 2026 China Western Semiconductor and Integrated Circuit Industry Expo represents a strategic opportunity for stakeholders across the semiconductor ecosystem to engage with emerging technologies, forge partnerships, and shape the future of this critical industry.